By Samar Abd El-Hady and Wael ElManhawy
Design teams today face an uncomfortable truth: the specialized tools they need to verify modern ICs can’t reliably share the same design data. As geometries shrink below five nanometers and designs incorporate billions of transistors across multiple dies, no single Electronic Design Automation (EDA) tool can address every verification, analysis and modeling challenge.
Design teams routinely use specialized tools for parasitic extraction, power integrity analysis, electromagnetic simulation and soft error rate prediction. Each tool excels in its domain, but this creates a fundamental problem: how do you make sure that all these tools work from the same verified design data without manual translation, reformatting or error-prone data transfers?
This interoperability crisis demands a solution that can bridge the gap between verification and analysis tools. The Calibre Connectivity Interface (CCI) does this by transforming Layout vs. Schematic (LVS) verification data into a universal data source that downstream tools can query with precision and confidence.
Mining the SVDB: How CCI extracts verified design data
At its core, CCI operates on the Standard Verification Database (SVDB) generated during a Calibre nmLVS verification run. This database contains far more than simple pass or fail verification results. The SVDB captures the complete connectivity graph of the design, including layout geometry coordinates, net topology, device parameters, hierarchical relationships and the critical mapping between layout elements and their corresponding schematic or source names.
CCI provides a structured query interface to this rich dataset. Through the Query Server Tcl shell and Calibre YieldServer implementations, downstream tools can extract precisely the information they need. A typical CCI workflow begins with a completed LVS run that generates the SVDB. The CCI command file then specifies what data to extract and in what format. The interface processes these commands against the SVDB and outputs files tailored to the requirements of specific third-party tools.
Figure 1 illustrates this flow, showing how layout, source and rules feed into Calibre nmLVS, which generates the SVDB. CCI then acts as the bridge between this verified database and the diverse ecosystem of analysis tools.
Feeding parasitic extraction tools with accurate connectivity data
Third-party parasitic extraction tools represent one of the most demanding integration scenarios. These tools need comprehensive access to geometric layouts, detailed connectivity information, net and instance names, device characteristics and port definitions. The accuracy of parasitic RC models depends entirely on the fidelity of this input data.
CCI is specifically engineered to provide all this essential data through flexible application programming interfaces (APIs). Each parasitic extraction tool can precisely query and retrieve the specific data it needs. Here’s how different tools leverage CCI:
Empyrean’s PEX tool uses CCI data to generate layout analysis with parasitic RC extraction and critical path netlists with RC annotation.
Phlexing’s GloryEX extraction tool leverages CCI to support advanced 3D modeling for planar gate, FinFET, gate-all-around and other complex device structures. GloryEX also handles sophisticated process modeling including chemical mechanical planarization, etch effects and multi-patterning, while providing high-speed capacitance table generation and pattern matching for 2.5D flows at both gate and transistor levels.
Synopsys StarRC and Cadence QRC demonstrate CCI’s ability to interface with industry-standard sign-off tools. Both tools benefit from dedicated APIs that provide real-time access to device-level layout data, robust SPICE model correlation, geometry-to-schematic mapping, automated net hierarchy tracing and seamless integration into full-chip sign-off flows.
Correlating electromagnetic analysis for high-frequency designs
For high-speed designs operating at multi-gigahertz frequencies, electromagnetic effects in critical signal paths can determine whether a design meets timing and signal integrity requirements. Siemens collaborated with Lorentz Solution, Inc. to integrate Calibre nmLVS with Lorentz PeakView products using CCI.
Together, the tools create a high-frequency design flow that delivers ease of use while enabling IC and 3D IC designers to develop post-layout solutions correlated with source and schematic names, devices and hierarchy. This correlation throughout the electromagnetic analysis workflow means you can trace results back to specific design elements for debugging and optimization.
Streamlining power integrity analysis with comprehensive grid data
Power delivery network analysis has become critical as voltage margins shrink and current densities increase. CCI integrates with mPower, the Siemens power integrity solution that provides comprehensive analysis for digital, analog and complex 3D IC architectures across all design flows.
This integration enables high-resolution voltage drop (IR) and electromigration (EM) analysis, full-chip power grid modeling and accurate power pin annotation with connectivity tracing. The key enabler is CCI’s ability to seamlessly provide all essential input data to the mPower flow—Annotated Geometry Files (AGF), detailed device data and cross-reference files. Figure 2 illustrates how CCI feeds this critical data into the mPower design import flow, ensuring accurate and efficient execution of power integrity analyses.
Automating soft error analysis for radiation-hardened designs
Many semiconductor devices operate in harsh environments, from automotive applications to aerospace systems, making soft error analysis essential. CCI successfully interfaces with IROC Technologies, a leader in enhancing electronic system reliability through specialized EDA solutions.
IROC’s cell-level soft error detector, TFIT (Transistor Failure in Time), needs precise transistor drain and source diffusion coordinates from GDS files to perform its analysis. The output consists of detailed sensitivity maps identifying vulnerable zones within the design. Before integrating with CCI, IROC relied on a custom LVS module with limited technology support and error-prone workflows.
By integrating with Calibre nmLVS through CCI, a new reliable and automated flow emerged. Figure 3 compares the previous TFIT design import flow with the new automated flow using Calibre nmLVS and CCI. The new flow extracts accurate drain and source locations, executes the TFIT flow with precise input data, eliminates previous technical limitations and streamlines the entire analysis process.
Deploying CCI across multi-tool verification workflows
To understand the practical value of CCI, consider these real-world applications across multi-tool workflows: In automotive IC sign-off, design teams combine parasitic extraction using StarRC with soft error rate analysis using TFIT. CCI makes sure both tools get consistent, verified design data so you can count on functional correctness and reliability over extended temperature and voltage ranges.
For 2.5D and 3D IC integration, a single design stack benefits from CCI feeding both mPower and GloryEX simultaneously. This lets you run comprehensive interposer parasitic analysis and package power analysis from a common verified database, eliminating potential inconsistencies from using different data sources.
Analog and mixed-signal designers leverage CCI for electromagnetic validation, parasitic-aware simulation and noise coupling prediction with various third-party tools. The ability to maintain correlation between layout and schematic throughout these analyses proves crucial for sensitive analog circuits where small parasitic differences can affect performance.
Building a foundation for seamless multi-tool integration
In today’s complex IC design landscape, seamless collaboration between EDA tools has evolved from a convenience to an absolute necessity. The Calibre Connectivity Interface serves as a critical integration hub, enabling efficient data exchange and communication across diverse design and verification workflows.
By transforming LVS verification data from a simple pass or fail check into a comprehensive, queryable design database, CCI provides a robust foundation for the specialized tool ecosystem that modern IC design requires. As design complexity continues to increase and new analysis requirements emerge, this foundational integration technology proves indispensable for enhancing design accuracy, streamlining verification cycles and accelerating time-to-market for cutting-edge semiconductor innovation.
Samar Abd El-Hady is a Advanced Product Engineer, Calibre Design to Silicon Division, at Siemens EDA, a part of Siemens Digital Industries Software. She is supporting Calibre LVS, layers promotion, CCI, V2LVS and ML activities . Samar has been working in Siemens EDA for over 6 years. Before, she received her BS in electronics & communication engineering in 2019 from Ain Shams University in Cairo, Egypt. After graduation, Samar joined Siemens EDA as a PE supporting Calibre LVS.
Wael ElManhawy is a Director in Calibre Management at Siemens EDA, responsible for leading the Calibre LVS product line. He brings 29 years of experience in VLSI and EDA, specializing in physical and circuit verification, including 26 years at Siemens EDA and 21 years working on Calibre, where he has played a key role in shaping different Calibre products strategy, technology, and customer adoption at the most advanced nodes.
Also Read:
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Siemens Fuse EDA AI Agent Releases to Orchestrate Agentic Semiconductor and PCB Design
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Facts Only
Design teams use specialized EDA tools for parasitic extraction, power integrity analysis, electromagnetic simulation, and soft error rate prediction.
Modern ICs with geometries below five nanometers and billions of transistors require multiple tools, creating interoperability challenges.
The Calibre Connectivity Interface (CCI) transforms LVS verification data into a universal data source for downstream tools.
CCI operates on the Standard Verification Database (SVDB) generated by Calibre nmLVS, which includes layout geometry, net topology, device parameters, and hierarchical relationships.
CCI provides a structured query interface via Query Server Tcl shell and Calibre YieldServer.
Empyrean’s PEX tool uses CCI for parasitic RC extraction and critical path netlists.
Phlexing’s GloryEX leverages CCI for 3D modeling of complex device structures like FinFET and gate-all-around.
Synopsys StarRC and Cadence QRC integrate with CCI for sign-off parasitic extraction.
Siemens collaborated with Lorentz Solution to integrate Calibre nmLVS with Lorentz PeakView for electromagnetic analysis.
CCI integrates with Siemens mPower for power integrity analysis, providing high-resolution IR drop and electromigration analysis.
IROC Technologies uses CCI for soft error analysis in radiation-hardened designs, extracting precise transistor coordinates.
CCI is deployed in automotive IC sign-off, 2.5D/3D IC integration, and analog/mixed-signal design workflows.
Samar Abd El-Hady is an Advanced Product Engineer at Siemens EDA, supporting Calibre LVS and CCI.
Wael ElManhawy is a Director in Calibre Management at Siemens EDA, with 29 years of experience in VLSI and EDA.
Executive Summary
The semiconductor industry faces growing challenges as IC designs become more complex, with geometries shrinking below five nanometers and incorporating billions of transistors across multiple dies. No single EDA tool can handle all verification, analysis, and modeling tasks, leading to interoperability issues between specialized tools for parasitic extraction, power integrity analysis, electromagnetic simulation, and soft error rate prediction. The Calibre Connectivity Interface (CCI) addresses this by transforming Layout vs. Schematic (LVS) verification data into a universal data source that downstream tools can query. CCI operates on the Standard Verification Database (SVDB) generated during Calibre nmLVS verification, which contains comprehensive design data including layout geometry, net topology, and device parameters. This allows tools like Empyrean’s PEX, Phlexing’s GloryEX, Synopsys StarRC, and Cadence QRC to access precise data for parasitic extraction, while also enabling integration with electromagnetic analysis tools like Lorentz PeakView and power integrity solutions like Siemens mPower. Additionally, CCI streamlines soft error analysis for radiation-hardened designs by providing accurate transistor data to tools like IROC’s TFIT. The interface is deployed across multi-tool workflows in automotive IC sign-off, 2.5D/3D IC integration, and analog/mixed-signal design, ensuring consistency and reducing manual errors. As design complexity increases, CCI serves as a critical integration hub, enhancing accuracy and efficiency in semiconductor verification and analysis.
The article highlights real-world applications where CCI bridges gaps between tools, such as combining parasitic extraction with soft error analysis in automotive designs or enabling simultaneous power and parasitic analysis in 3D ICs. The authors, Samar Abd El-Hady and Wael ElManhawy, emphasize that CCI’s ability to maintain correlation between layout and schematic data is essential for sensitive analog circuits and high-frequency designs. By eliminating manual data translation and ensuring all tools work from the same verified database, CCI accelerates verification cycles and improves design reliability. The technology is positioned as indispensable for modern IC design, where collaboration between diverse EDA tools is no longer optional but a necessity.
Full Take
The article presents a compelling case for the necessity of interoperability in modern IC design, where the complexity of sub-5nm geometries and multi-die architectures has outpaced the capabilities of any single EDA tool. The Calibre Connectivity Interface (CCI) is positioned as a solution to this fragmentation, acting as a bridge between specialized tools by leveraging verified LVS data. The strongest version of this narrative is that CCI eliminates manual data translation errors, ensures consistency across tools, and accelerates verification cycles—critical for industries like automotive and aerospace where reliability is paramount.
However, the article does not address potential limitations or challenges in adopting CCI, such as compatibility with legacy tools, learning curves for engineers, or performance overhead in large-scale designs. The focus on Siemens’ proprietary solutions also raises questions about vendor lock-in and whether CCI’s benefits are accessible to teams using non-Siemens tools. Additionally, while the article highlights successful integrations with third-party tools, it does not explore cases where CCI might fall short or require custom adaptations.
The root cause of this narrative is the growing complexity of semiconductor design, where specialization has led to tool fragmentation. The unstated assumption is that a centralized data hub like CCI is the most efficient way to manage this complexity, rather than alternative approaches like open standards or tool consolidation. Historically, this echoes the evolution of software ecosystems where interoperability layers (e.g., APIs, middleware) emerge to manage diversity.
For human agency, CCI could reduce cognitive load on engineers by automating data translation, but it also centralizes control over design data flow. The beneficiaries are likely large semiconductor firms with resources to adopt integrated workflows, while smaller teams might face barriers. Second-order consequences could include reduced innovation in competing interoperability solutions or over-reliance on a single vendor’s ecosystem.
Bridge questions: What are the trade-offs between using a proprietary integration hub like CCI versus open standards? How might CCI’s reliance on Calibre nmLVS limit its adoption in workflows using other LVS tools? What would a failure case for CCI look like, and how would teams mitigate it?
Counterstrike scan: If this were part of a coordinated influence campaign, the playbook would emphasize the inevitability of tool fragmentation and position CCI as the only viable solution, downplaying alternatives. However, the article does not exhibit this pattern; it presents CCI as one solution among potential others and acknowledges the broader industry challenge without dismissing competitors. The content aligns with a genuine technical discussion rather than a manipulative narrative.
Patterns detected: none
Sentinel — Human
The text exhibits the deep, specialized knowledge and structured, evidence-based narrative typical of human experts in the semiconductor design field, focusing on systemic integration challenges.