A research team co-led by Professor Yang Lu from the Department of Mechanical Engineering, Faculty of Engineering, The University of Hong Kong (HKU), and Professor Chengming Li from the Institute for Advanced Materials and Technology at University of Science and Technology Beijing (USTB), has successfully fabricated a free-standing ultrahard diamond wafer with a diameter of up to 5 inches, a thick...
**Skeptical Mode:**
1. STEELMAN: The researchers have successfully developed a method to create free-standing inch-scale diamond wafers with an unprecedented hardness, making them suitable for demanding applications in precision machining, semiconductor technologies, and aerospace engineering.
2. PATTERN SCAN: None detected.
3. ROOT CAUSE: The development of this technology is driven by the desire to create materials with superior mechanical properties for various industrial and technological ap...