Impressive as it most certainly is when an amateur fabricates a semiconductor, most of the projects we’ve seen are more demonstrations than workable chips. [Dr. Semiconductor], however, is going much further with his fabrication process, and is already working on a method to bond chips to printed circuit boards. It’s difficult to align a PCB with the pads on the underside of an opaque silicon wafer, however, so as a trial run he’s made and bonded some transparent LED chips.
The starting material for these chips is a gallium nitride (GaN) LED epiwafer, a stacked structure of n-doped GaN, an indium gallium nitride quantum well layer, and p-doped GaN grown on a sapphire substrate. When current passes through the structure, electrons from the n-doped layer and holes from the p-type layer recombine in the quantum well layer, emitting blue light. To make a functional LED from this, [Dr. Semiconductor] needed to make electrical contacts to both the n-type and p-type layers. Making the n-type contact required cutting through the p-type and quantum well layers.
This would normally be done with reactive ion etching in chlorine, but [Dr. Semiconductor] came up with a new process: a 355-nm ultraviolet etching laser causes GaN to break down into gallium and nitrogen, with the resulting cut being cleaned up by a potassium hydroxide etch. To deposit the contacts themselves, [Dr. Semiconductor] formed a photoresist mask, deposited metal (nickel, silver, and titanium) in a sputtering chamber, and used a developer solution to dissolve the mask and lift off the unwanted metal regions.
When [Dr. Semiconductor] applied current between the two contacts, the LED glowed bright blue. The next step was to mount it to a PCB; to do so, he first sliced the wafer into individual LED chips with the ultraviolet laser. He then electroplated indium bumps onto a printed circuit board, positioned the chip above these bumps, added some rosin flux, and melted the indium bumps. This soldered the chip to the board and let the board power the LED.
Like most commercial LEDs, these were blue; most LED assemblies additionally include a phosphor layer which absorbs blue light and emits another color. To create a white LED, for example, [Dr. Semiconductor] mixed cerium-doped yttrium aluminium garnet phosphor powder with clear silicone and spread it over the LED. This absorbs some of the blue light and emits yellow light, and the resulting mixture of blue and yellow light looks white to human eyes.
We’ve previously covered some of the history of LEDs and the phosphors which make them useful. This seems to be the first inorganic LED we’ve seen, but we’ve also seen a few homemade OLEDs.
Thanks to [SpuriousIndices] for the tip!
I was quite literally thinking the other day that if we can — theoretically — make diy RAM then an LED shouldn’t be impossible either.
Glad to see that is actually the case.
“yttrium aluminium garnet phosphor power” should be “[…] powder”
Oops. Thanks for the correction!
“Like most commercial LEDs, these were blue” – that is such an amazing thing considering the history of LEDs and the color blue. (I’m not arguing the fact, I expect it would be true with the push between blue and white LEDs pushing it far into the most produced category).
What I hope to see with these projects is that a maker focused little silicon fab comes about.
We don’t need super tiny transistors, so we should be able to find a way to bodge something together that will still have a high success rate.
Base everything around using DNA for computing and memory.
Facts Only
* Dr. Semiconductor worked on bonding chips to printed circuit boards.
* The initial trial involved bonding transparent LED chips.
* The starting material was a gallium nitride (GaN) LED epiwafer, which is a stacked structure of n-doped GaN, an indium gallium nitride quantum well layer, and p-doped GaN on a sapphire substrate.
* Electrical contacts required cutting through the layers.
* A novel etching process used a 355-nm ultraviolet etching laser to break down GaN, followed by a potassium hydroxide etch.
* Metal contacts were formed via photoresist masking, sputtering of nickel, silver, and titanium, and subsequent development to lift off mask regions.
* The LED glowed bright blue when current was applied between the two contacts.
* LED chips were sliced from the wafer using the ultraviolet laser.
* Indium bumps were electroplated onto a PCB, and the chip was mounted over them with rosin flux before melting the bumps to solder the chip to the board.
* White light was created by mixing cerium-doped yttrium aluminium garnet phosphor powder with silicone to absorb blue light and emit yellow light.
Executive Summary
Full Take
Sentinel — Human
This text reads like an enthusiastic technical article or a blog post featuring personal reflections and dialogue, indicating a strong human editorial presence rather than purely automated generation.
