Managing power, heat, and complexity for reliability and performance.
By John Ferguson and Sheltha Nolke
For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate heat and navigate the intricate dance of physics within these stacked architectures? While 3D-IC...
The article presents an argument for the importance of an integrated approach to address the challenges faced by design teams adopting 3D-IC architectures.
It suggests that close cooperation among various stakeholders is essential to achieving high-yield, reliable 3D-IC designs with optimal electrical behavior.
The article highlights the need for automated multiphysics analysis and a shift-left methodology in addressing the complexity of managing power, thermal dissipation, and physical interact...