HANMI Semiconductor Ships First ‘FC Bonder 75’ for AI System Semiconductors

HANMI Semiconductor today announced that it has shipped the first “FC Bonder 75” to a customer. Designed for 2.5D AI semiconductor packaging, the new system marks the company’s expansion beyond High Bandwidth Memory (HBM) into system semiconductor packaging.
As AI semiconductors become increasingly sophisticated, 2.5D packaging technologies that integrate multiple chips — including CPUs, GPUs, and HBM — into a single package have gained prominence, driving an expansion in interposer and substrate size. This, in turn, is increasing the demand for higher-specification packaging equipment among foundries and outsourced semiconductor assembly and test (OSAT) companies.
A prominent example of 2.5D packaging technology is TSMC’s Chip on Wafer on Substrate (CoWoS). TSMC plans to further advance its packaging methods from CoWoS to Chip on Panel on Substrate (CoPoS) and 3D System on Integrated Chips (3D-SoIC), as adoption of TSMC’s packaging technology has been increasing among OSAT providers. More recently, Intel’s Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology has increasingly been applied to the application-specific integrated circuit (ASIC) chips of U.S. technology leaders, including Google’s TPUs.
The FC Bonder 75 is a flip-chip (FC) bonding system, which places semiconductor dies face down so conductive bumps on the chip connect directly to an interposer. This enables the high-density interconnections and shorter electrical paths that are widely used in advanced 2.5D packages.
HANMI Semiconductor’s FC Bonder 75 supports interposer packages measuring 75 mm × 75 mm, compared with the conventional general-purpose packaging size of 20 mm × 20 mm. The larger format accommodates the ultra-large dies and multi-chip integration required for next-generation AI semiconductors.
HANMI Semiconductor has also expanded its 2.5D packaging equipment portfolio. This year, the company has launched the “FC Bonder 3.5,” “2.5D TC Bonder 40 C2S,” and “2.5D TC Bonder 40 C2W,” and is preparing to launch the “2.5D TC Bonder 120.”
The broader equipment lineup is expected to create synergy with the establishment of its U.S. subsidiary, HANMI USA, planned for October of this year. This move is intended to serve demand from major technology companies, foundries, OSAT providers, and memory manufacturers in the U.S., where operations are expected to ramp up in earnest by 2028.
“Starting with the FC Bonder 75, we are expanding our technological competitiveness in the AI semiconductor market by supplying our customers with TC Bonders for HBM and AI packaging, as well as a wide range of other packaging equipment,” said a HANMI Semiconductor official. “Through these products, we will continue to deliver sustainable revenue growth.”

Facts Only

* HANMI Semiconductor shipped the first “FC Bonder 75” to a customer.
* The FC Bonder 75 is designed for 2.5D AI semiconductor packaging.
* The technology involves flip-chip (FC) bonding, connecting conductive bumps directly to an interposer.
* The FC Bonder 75 supports interposer packages measuring 75 mm × 75 mm.
* Conventional general-purpose packaging size is 20 mm × 20 mm.
* HANMI launched the “FC Bonder 3.5,” “2.5D TC Bonder 40 C2S,” and “2.5D TC Bonder 40 C2W.”
* The company is preparing to launch the “2.5D TC Bonder 120.”
* HANMI plans to establish a U.S. subsidiary, HANMI USA, in October.
* This expansion aims to serve demand from major technology companies and foundries in the U.S. by 2028.

Executive Summary

HANMI Semiconductor shipped the first "FC Bonder 75" designed for 2.5D AI semiconductor packaging, expanding its capabilities beyond High Bandwidth Memory (HBM) into system packaging. This development is driven by the trend in AI semiconductors toward 2.5D packaging, which integrates multiple chips like CPUs, GPUs, and HBM into a single package, necessitating larger interposer and substrate sizes. The FC Bonder 75 is a flip-chip bonding system supporting 75 mm × 75 mm interposer packages, a size increase over conventional 20 mm × 20 mm packaging. HANMI has expanded its equipment portfolio with the launch of other bonders, including "FC Bonder 3.5," “2.5D TC Bonder 40 C2S,” and “2.5D TC Bonder 40 C2W,” with plans for a future "2.5D TC Bonder 120." The company is preparing to establish a U.S. subsidiary, HANMI USA, in October to serve demand from major technology companies and foundries, anticipating increased operations by 2028.

Full Take

The narrative connects the physical evolution of semiconductor packaging—moving from traditional setups to 2.5D integration methods like CoWoS and subsequent advancements toward CoPoS and 3D-SoIC—directly to the demand for advanced bonding equipment. The shift in physical dimensions, exemplified by the move from 20mm to 75mm packages facilitated by the FC Bonder 75, highlights a pattern where technological capability forces a corresponding material and tooling evolution. The core implication is that access to high-density interconnects is gated by the availability of specific, high-specification equipment capable of handling larger die structures. HANMI’s expansion strategy, tied to establishing a U.S. presence, suggests a systemic recognition that infrastructure development must occur alongside technological advancement for market capture. The focus on supplying TC Bonders for HBM and AI packaging positions the company at a critical juncture where semiconductor manufacturing capacity meets advanced system integration demands. The pattern observed is that specialized equipment innovation acts as an accelerant, pushing broader industry standards toward multi-chip packaging methodologies.

Sentinel — Human

Confidence

The text reads like a standard, professionally written B2B press release focused on semiconductor equipment and market positioning, exhibiting high technical specificity without clear signs of synthetic manipulation.

Signals Detected

Moderate sentence length variance; professional and technical tone.

Flows logically from specific product announcement to broader industry context (2.5D packaging) and then back to company strategy.

Uses specific technical names (CoWoS, EMIB-T, FC Bonder 75) correctly within a contextually appropriate narrative flow.

The structure strongly resembles standard B2B press release style, focusing on product launch and market positioning. Lacks the overly smooth or generic hedging typical of pure LLM output.

Human Indicators

Specific details regarding product lines (FC Bonder 75) and planned expansion timelines (HANMI USA by October, ramp-up by 2028) suggest grounding in real corporate reporting.

The concluding quote provides a direct, goal-oriented business justification rather than pure descriptive filler.